Bernard Aspar: search on Z-Library

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1

A new manufacturing approach for mono-crystalline SiC wafers

Fabrice Letertre, Bruno Ghyselen, Bernard Aspar

Journal:

Year:

2002

Language:

english

File:

PDF, 450 KB

english, 2002

2

Accurate control of the misorientation angles in direct wafer bonding

Fournel, Frank, Moriceau, Hubert, Aspar, Bernard, Rousseau, Karine, Eymery, JoeÌl, RouvieÌre, Jean-Luc, Magnea, NoeÌl

Journal:

Applied Physics Letters

Year:

2002

Language:

english

File:

PDF, 708 KB

english, 2002

3

[IEEE 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT) - Beijing, China (2008.10.20-2008.10.23)] 2008 9th International Conference on Solid-State and Integrated-Circuit Technology - Current status and possibilities of wafer-bonding-based SOI technology in 45nm or below CMOS LSIs

Makoto Yoshimi,, Delpra, Daniel, Cayrefourcq, Ian, Celler, George, Mazure, Carlos, Aspar, Bernard

Year:

2008

Language:

english

File:

PDF, 2.65 MB

english, 2008

4

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

Aspar, Bernard, Lagahe-Blanchard, Chrystelle, Sousbie, Nicolas, Margail, Jacques, Moriceau, H.

Year:

2006

Language:

english

File:

PDF, 781 KB

english, 2006

5

QuaSiC Smart-Cut

Letertre, Fabrice, Jalaguier, E., Di Cioccio, Lea, Templier, Francois, Bluet, Jean Marie, Banc, C., Matko, Igor, Chenevier, Bernard, Bano, Edwige, Guillot, Gérard, Billon, Thierry, Aspar, B., Madar, R

Journal:

Materials Science Forum

Year:

2002

File:

PDF, 339 KB

2002

6

Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding *1

Bruel, Michel, Aspar, Bernard, Auberton-Hervé, Andre-Jacques

Journal:

Japanese Journal of Applied Physics

Year:

1997

File:

PDF, 2.58 MB

1997

7

[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - Engineered substrates: The foundation to meet current and future RF requirements

Le Meil, Jean-Marc, Aspar, Bernard, Desbonnets, Eric, Raskin, Jean-Pierre

Year:

2015

Language:

english

File:

PDF, 1021 KB

english, 2015

8

[IEEE 2015 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] VLSI Design, Automation and Test(VLSI-DAT) - Engineered substrates: The foundation to meet current and future RF requirements

Le Meil, Jean-Marc, Aspar, Bernard, Desbonnets, Eric, Raskin, Jean-Pierre

Year:

2015

Language:

english

File:

PDF, 1.82 MB

english, 2015